As per details Qualcomm appears to be gearing up to release a toned-down version of the Snapdragon 888 (SM8350) chip.
The news comes from leaker Roland Quandt, who says that unlike the flagship Snapdragon 888, the stripped-down variant will not have an integrated 5G modem.
Vivo X60 series to launch on March 22 with Snapdragon 870
The company is currently testing samples that are compatible with 12GB of LPDDR5 RAM and 256GB of storage. The next-generation chip’s camera capabilities are also expected to get a major boost and it seems that Qualcomm has teamed up with optics specialist Leica for this purpose. Current testing is apparently centered on a module internally known as “Leica1.”
The Snapdragon 888 was made by Samsung and the recently announced 5G modems (Snapdragon X62 and Snapdragon X65) are based on the chaebol’s 4nm process. It’s not known if Snapdragon 888’s successor will also be built on a new process node.
A recent report says that Qualcomm will stick with Samsung’s 5nm tech for this year and go back to TSMC in 2022 for a 4nm flagship SoC.
Qualcomm SM7325: 1x 2,7GHz, 3x 2,4 GHz, 4x 1,8 GHz. Dev board has up to 16 GB RAM
Test platforms w/ 256GB UFS 3.1 and 12GP LPDDR5 available for hardware partners.
— Roland Quandt (@rquandt) March 8, 2021
Quandt has also revealed the existence of a mid-tier chip. The SM7325 apparently features one core running at 2.7GHz, three cores with clock speeds of 2.4 GHz, and four cores with frequencies up to 1.8 GHz. The test platform supports up to 12GB of LPDDR5 RAM and 256GB of UFS 3.1 storage. The final product may support up to 16GB of RAM.