AMD’s new CPU has achieved great success with its small chip design and advanced manufacturing process. Intel has also released a 3D packaged CPU.
However, at present, small chips only provide a competitive advantage for a few companies. If this technology “continues life” for Moore’s Law to be popularized, it faces technical challenges, including standards, yield, power consumption, heat dissipation, tools, testing, etc.
Challenges, but also facing ecological and manufacturing challenges. No one can accurately judge when the small chip will become popular, but it is certain that this will be a slow process. Chiplets (Chiplets, also translated as core particles) is a compelling technology, but so far, there are not many products using chipset technology and not many participants
. While continuing to develop new process nodes, due to physical limitations or cost reasons, the further scaling of transistors is coming to an end. Many industries require more transistors than the latest process nodes can provide.
At the same time, because the die cannot be increased without affecting the yield, the development cost of a 3nm chip can only be borne by a few people. For sub-industries where the demand for chips is not in the millions, the cost of advanced nodes is unaffordable and small.